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Brand Name : PLINK
Model Number : Y-C8-DEV-Orin32
Place of Origin : China
MOQ : 1
Price : To be discussed
Payment Terms : L/C, D/A, D/P, T/T
Supply Ability : 1+set+4weeks
Delivery Time : 15-30 work days
Packaging Details : 195mm × 180mm × 50mm
NAME : NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000
Keyword : NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000
Memory : 32GB 256-bit LPDDR4 x 136.5GB/s
AI Perf : 200 TOPS
DL Accelerator : 2x NVDLA v2
Single Package Size : 188mm × 170mm × 43mm
Input Power : DC +12V
Temperature Range : -25℃ to 65℃
GPIO(3.3V) *1 : *1
RS 232 : *2
Vision Accelerator : 1x PVA v2
NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000
NVIDIA Jetson AGX Orin Developer Kit Y-C8 AGX Orin module 32G 900-13701-0040-000
The Y-C8-DEV-Orin 32G is self-developer kit by PLINK-AI,and it based on NVIDIA Jetson AGX Orin module, Jetson AGX Orin Module SOM Up To 200 TOPS of AI performance 900-13701-0040-000 and it is for industrial such as autonomous, VR, drones, robotics and logistics. NVIDIA Jetson AGX Orin module (900-13701-0040-000) with the Ampere GPU architecture, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. and gives you more than 6X the performance of Jetson AGX Xavier in the same compact form-factor for robotics and other autonomous machine use cases.
Jetson AGX Orin 32G domestic developer kit
Y-C8 development Board + NVIDIA Jetson AGX Orin Module (32G) 900-13701-0040-000 + Cooling FAN
NVIDIA Jetson AGX Orin Module (32G) Technical Specifications
| AI Perf | 200 TOPS |
| GPU | 1,792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores |
| CPU | 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU |
| Memory | 32GB 256-bit LPDDR5 |
| Storage | 64GB eMMC 5.1 |
| USB | 3x USB 3.2 Gen2 (10 Gbps) |
| Camera | Up to 6 cameras (16 via virtual channels) |
| Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
| USB Micro-B | 1 x Type B (OTG) |
| USB Type-A | 1 x USB 3.1 |
| GPIO(3.3V) | 1 |
| SPI(3.3V) | 1 |
| I2C(3.3V) | 2 |
| RS 232 | 2 |
| Debug(UART) | 1 |
| CAN (with on-board transceiver) | 2 |
| Networking | 1 x 10/100/1000 Ethernet/RJ45 |
| Power Supply | DC +12V |
| Temperature | -25~+65°C |
| Size | 188mm × 170mm × 43mm |

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32G Industrial Embedded System 900-13701-0040-000 Images |